【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Part21:Solderability(IEC60749-21:2011);GermanversionEN60749-21:2011
【原文标准名称】:半导体设备.机械和气候试验方法.第21部分:可焊性(IEC60749-21-2011).德文版EN60749-21-2011
【标准号】:DINEN60749-21-2012
【标准状态】:现行
【国别】:德国
【发布日期】:2012-01
【实施或试行日期】:2012-01-01
【发布单位】:德国标准化学会(DE-DIN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Backwardcompatibility;Changesoftemperature;Climate;Climatictests;Components;Cyclicloading;Dimensions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Environmentaltests;Impurities;Integratedcircuits;Leadfree;Mechanicaltesting;Resistance;Semiconductordevices;Semiconductors;Simulation;SMD;Solderability;Solderings;Surfacemounting;Temperature;Testing;Visualinspection(testing)
【摘要】:
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:23P;A4
【正文语种】:德语


Product Code:SAE AMS3107/2
Title:Primer, Adhesive, Corrosion-Inhibiting, High Durability Epoxy, -55 to +120Mdc (-67 to +248Mdf)
Issuing Committee:Ams P17 Composite Materials Committee
Scope:This specification covers a corrosion-inhibiting, modified epoxy resin primer in the form of a ready-to-use, sprayable liquid. Primarily for use as a primer on metal surfaces in preparation for high-durability, structural, adhesive bonding of sandwich panels and for metal-to-metal attachments or as a primer in preparation for final paint-type finishing.